電鍍污水PCB板污水重金屬銅鎳去除杜笙鰲合樹脂CH-90

適合于重金屬銅鎳鉛鋅等重金屬深度去除，頁可以高濃度的回收重金屬，PH0-14的范圍都比較適合，其中對絡(luò)合態(tài)的重金屬也具有很好的去除能力。適合運用在電鍍行業(yè)去除重金屬，以及PCB板污水中去除重金屬。

型式/Type:弱酸型陽離子交換樹脂/Weakacidcationexchangeresin
結(jié)構(gòu)/Matrixstructure:巨孔狀交叉鍵結(jié)聚苯乙烯/
Macroporouscrosslinkedpolystyrene
官能基/Functionalgroup:Iminodiacetic
物理型式/Physicalform:含水球狀/Moistsphericalbeads
離子型式/Ionicasshipped:鈉/Sodium
粒徑分布/ScreensizeUSS(wet):16to50
粒徑大小/Particlesize:0.3to1.2mm
總交換容量/TotalExc.Capacity:1.8meq/ml(H+)
膨脹系數(shù)/Swelling(approx.):H+→Na+20%
含水份/Moisture:45-50%
pH作范圍/SuitablepHrange:0to14
溶解率/Solubility:不溶解于任何溶劑/Insolubleincommonsolvents

逆洗沉降密度/Backwashsettleddensity:0.72to0.79g/ml

去除2+2價金屬離子的選擇性螯合離子交換樹脂
SELECTIVEIONEXCHANGERESINFORREMOVALOFBIVALENTmetaLS.
建議操作條件////OPERATINGCONDITIONS
最大操作溫度/Max.OperatingTemperature:
oC
流速/Serviceflow:10–30BV/hr
逆洗膨脹空間/Backwashexpansionspace:50to70%
逆洗流速/Backwashexpansionflow:BV/hr
再生////Regeneration
酸濃度/Concentrationofacid:5-8%
流速/Flowrate:3–4BV/hr
再生酸藥劑量/Regenerationquantity:150-200g/litofHCl
:200-250g/litofHHHH2222SO4444
慢洗流速/Rinseflowrate:3–4BV/hr
若需要轉(zhuǎn)成aNa離子/Conversiontosodiumformifrequired
濃度/Concentration:2-4%
流速/Flow:4BV/hr
鹽藥量/NaOHquantity:50-150g/lit
慢洗流速/Rinseflowrate:3–4BV/hr

最有效的除銅pH:3-4
EffectivepHforcopperremoval
最有效的除鎳pH:3-5
EffectivepHfornickelremoval
最有效的除鐵pH:2-4
EffectivepHforironremoval
最有效的除鉛pH:2以上
EffectivepHforleadremoval
最有效的除錳pH:4以上
EffectivepHformanganese
選擇性的順序如下:
Orderofselectivityisasfollows
Cu>Pb>Ni>Zn>Co>Cd>Fe+3>Mn>Mg>Ca>>Na